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BSI
FEATURES
Ultra Low Power/Voltage CMOS SRAM 512K X 16 bit
DESCRIPTION
BS616UV8011
* Ultra low operation voltage : 1.8 ~ 2.3V * Ultra low power consumption : Vcc = 2.0V C-grade: 20mA (Max.) operating current I-grade : 25mA (Max.) operating current 0.6uA (Typ.) CMOS standby current * High speed access time : -70 70ns (Max.) at Vcc=2V -10 100ns (Max.) at Vcc=2V * Automatic power down when chip is deselected * Three state outputs and TTL compatible * Fully static operation * Data retention supply voltage as low as 1.5V * Easy expansion with CE2,CE1 and OE options * I/O Configuration x8/x16 selectable by LB and UB pin
The BS616UV8011 is a high performance, ultra low power CMOS Static Random Access Memory organized as 524,288 words by 16 bits and operates from a wide range of 1.8V to 2.3V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.6uA and maximum access time of 70/100ns in 2V operation. Easy memory expansion is provided by an active LOW chip enable(CE1), active HIGH chip enable (CE2), active LOW output enable(OE) and three-state output drivers. The BS616UV8011 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS616UV8011 is available in 48-pin BGA package.
PRODUCT FAMILY
PRODUCT FAMILY OPERATING TEMPERATURE Vcc RANGE SPEED (ns) POWER DISSIPATION STANDBY (ICCSB1, Max) Operating (ICC , Max) PKG TYPE
Vcc=2V
Vcc=2V 15uA
Vcc=2V 20mA
BS616UV8011DC O O BS616UV8011BC +0 C to +70 C 1.8 ~ 2.3V BS616UV8011FC BS616UV8011DI O O BS616UV8011BI - 40 C to +85 C 1.8 ~ 2.3V BS616UV8011FI PIN CONFIGURATIONS
1 A B C D E F G H LB D8 D9 VSS VCC D14 D15 A 18 2 OE UB D10 D11 D12 D13 NC . A8 3 A0 A3 A5 A17 VSS A14 A 12 A9 4 A1 A4 A6 A7 A16 A15 A13 A10 5 A2 CE1 D1 D3 D4 D5 WE A11 6 CE2 D0 D2 VCC VSS D6 D7
70 / 100
70 / 100
20uA
25mA
DICE BGA -48 -0810 BGA -48 -0912 DICE BGA -48 -0810 BGA -48 -0912
BLOCK DIAGRAM
A4 A3 A2 A1 A0 A17 A16 A15 A14 A13 A12 Address Input Buffer 22 Row Decoder 2048 Memory Array 2048 x 4096
4096 D0 16 Data Input Buffer 16 Column I/O
. . . .
D15 CE2 CE1 WE OE UB LB
. . . .
Write Driver
Sense Amp 256 Column Decoder
16
Data Output
16
Buffer
16 Control Address Input Buffer
NC
A11 A10 A9 A8 A7 A6 A5 A18
Vcc Gnd
48-Ball CSP top View
Brilliance Semiconductor Inc. reserves the right to modify document contents without notice.
R0201-BS616UV8011
1
Revision 2.2 April 2001
BSI
PIN DESCRIPTIONS
BS616UV8011
Function
These 19 address inputs select one of the 524,288 x 16-bit words in the RAM. CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. Lower byte and upper byte data input/output control pins. These 16 bi-directional ports are used to read data from or write data into the RAM. Power Supply Ground
Name
A0-A18 Address Input CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input
WE Write Enable Input
OE Output Enable Input
LB and UB Data Byte Control Input D0 - D15 Data Input/Output Ports Vcc Gnd
TRUTH TABLE
MODE Not selected (Power Down) Output Disabled Read CE1 H X L L CE2 X L H H WE X X H H OE X X H L LB X X X L H L L Write L H L X H L UB X X X L L H L L H D0~D7 High Z High Z High Z Dout High Z Dout Din X Din D8~D15 High Z High Z High Z Dout Dout High Z Din Din X Vcc CURRENT ICCSB , ICCSB1 ICCSB , ICCSB1 ICC ICC ICC ICC ICC ICC ICC
ABSOLUTE MAXIMUM RATINGS(1)
SYMBOL VTERM TBIAS TSTG PT IOUT PARAMETER
Terminal Voltage Respect to GND with
OPERATING RANGE
UNITS
V
O
RATING
-0.5 to Vcc+0.5 -40 to +125 -60 to +150 1.0 20
RANGE
Commercial Industrial
AMBIENT TEMPERATURE
0 O C to +70O C -40 C to +85 C
O O
Vcc
1.8V ~ 2.3V 1.8V ~ 2.3V
Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
C C
O
W mA
CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz)
SYMBOL PARAMETER CONDITIONS MAX. UNIT
Input CIN VIN=0V 10 1. Stresses greater than those listed under ABSOLUTE MAXIMUM Capacitance RATINGS may cause permanent damage to the device. This is a Input/Output CDQ VI/O=0V 12 stress rating only and functional operation of the device at these Capacitance or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute 1. This parameter is guaranteed and not tested. maximum rating conditions for extended periods may affect reliability.
pF pF
R0201-BS616UV8011
2
Revision 2.2 April 2001
BSI
DC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC ) PARAMETER NAME
VIL VIH IIL IOL VOL VOH ICC ICCSB ICCSB1
BS616UV8011
TEST CONDITIONS
Vcc=2V Vcc=2V
PARAMETER
Guaranteed Input Low Voltage (2) Guaranteed Input High Voltage (2) Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Current -TTL
MIN. TYP.(1) MAX.
-0.5 1.4 ---1.6 -----------0.6 0.6
Vcc+0.2
UNITS V V uA uA V V mA mA uA
Vcc = Max, VIN = 0V to Vcc Vcc = Max, CE1 = V IH, or CE2 = ViL, or OE = VIH, VI/O = 0V to Vcc Vcc=2V Vcc = Max, IOL = 1mA Vcc=2V Vcc = Min, IOH= - 0.5mA Vcc=max, CE1=VIL and CE2= Vcc=2V VIH, IDQ = 0mA, F = Fmax (3) Vcc= max, CE1 =VIH or CE2 = VIL,IDQ = 0mA Vcc= max,CE1 Vcc-0.2V, or CE2 0.2V, VIN Vcc - 0.2V or VIN 0.2V
Vcc=2V
1 1 0.4 -20 0.6 15
Standby Current - CMOS
Vcc=2V
DATA RETENTION CHARACTERISTICS ( TA = 0 to + 70oC )
SYMBOL
VDR ICCDR tCDR tR
1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC .
PARAMETER
Vcc for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
O
TEST CONDITIONS
CE1 VIN CE1 VIN Vcc - 0.2V or CE2 0.2V Vcc - 0.2V or VIN 0.2V Vcc - 0.2V or CE2 0.2V Vcc - 0.2V or VIN 0.2V
MIN. TYP.
1.5 -0 TRC (2) --
(1)
MAX.
-10 ---
UNITS
V uA ns ns
0.4 ---
See Retention Waveform
1. Vcc = 1.5V, TA = + 25 C 2. tRC = Read Cycle Time
LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled )
Data Retention Mode
Vcc
VIH
Vcc
VDR 1.5V
Vcc
t CDR
CE1 Vcc - 0.2V
tR
VIH
CE1
LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled )
Data Retention Mode
Vcc
Vcc
VDR
1.5V
Vcc
t CDR
tR
CE2 0.2V
CE2
R0201-BS616UV8011
VIL
VIL
3
Revision 2.2 April 2001
BSI
AC TEST CONDITIONS
Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Vcc/0V 5ns 0.5Vcc
WAVEFORM INPUTS
BS616UV8011
KEY TO SWITCHING WAVEFORMS
OUTPUTS MUST BE STEADY WILL BE CHANGE FROM H TO L WILL BE CHANGE FROM L TO H CHANGE : STATE UNKNOWN CENTER LINE IS HIGH IMPEDANCE "OFF "STATE
MUST BE STEADY MAY CHANGE FROM H TO L
1333
AC TEST LOADS AND WAVEFORMS
2V OUTPUT
100PF
INCLUDING JIG AND SCOPE
1333
2V OUTPUT
MAY CHANGE FROM L TO H DON T CARE: ANY CHANGE PERMITTED DOES NOT APPLY
,
5PF 2000
INCLUDING JIG AND SCOPE
2000
FIGURE 1A
THEVENIN EQUIVALENT 800
FIGURE 1B
OUTPUT
1.2V
ALL INPUT PULSES
Vcc GND
10%
90% 90%
10%
5ns
FIGURE 2
AC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC, Vcc=2V)
READ CYCLE JEDEC PARAMETER PARAMETER NAME NAME DESCRIPTION
Read Cycle Time Address Access Time Chip Select Access Time Chip Select Access Time Data Byte Control Access Time Output Enable to Output Valid Chip Select to Output Low Z BS616UV8011-70 MIN. TYP. MAX. BS616UV8011-10 MIN. TYP. MAX.
UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns
tAVAX tAVQV tELQV tELQV tBA tGLQV tELQX tBE tGLQX tEHQZ tBDO tGHQZ tAXOX
tRC tAA t ACS1 t ACS2 tBA tOE tCLZ tBE tOLZ tCHZ tBDO tOHZ tOH
70 -(CE1) (CE2) (LB,UB) (CE2,CE1) ----10 10 10 0 0 0 10
--------------
-70 70 70 50 50 ---35 30 30 --
100 -----15 15 15 0 0 0 15
--------------
-100 100 100 60 60 ---40 35 35 --
Data Byte Control to Output Low Z (LB,UB) Output Enable to Output in Low Z Chip Deselect to Output in High Z (CE2,CE1) Data Byte Control to Output High Z (LB,UB) Output Disable to Output in High Z Output Disable to Address Change
R0201-BS616UV8011
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Revision 2.2 April 2001
BSI
SWITCHING WAVEFORMS (READ CYCLE)
READ CYCLE1 (1,2,4)
BS616UV8011
t RC
ADDRESS
t
D OUT
t
OH
AA
t OH
READ CYCLE2 (1,3,4)
CE2
t t
ACS2
ACS1
CE1
t
D OUT
(5) CLZ
(5) t CHZ
READ CYCLE3 (1,4)
ADDRESS
t RC
t
OE
AA
t
CE2
OE
t
OH
t t t t
(5) CLZ
ACS2
CE1
OLZ
ACS1
t t
OHZ CHZ
(5)
(1,5)
LB,UB
t
BE
t t
BA
BDO
D OUT NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE transition low. 4. OE = VIL . 5. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. R0201-BS616UV8011
5
Revision 2.2 April 2001
BSI
AC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC, Vcc=2V)
WRITE CYCLE JEDEC PARAMETER PARAMETER NAME NAME DESCRIPTION
Write Cycle Time Chip Select to End of Write Address Setup Time Address Valid to End of Write Write Pulse Width Write recovery Time
BS616UV8011
BS616UV8011-70 MIN. TYP. MAX. BS616UV8011-10 MIN. TYP. MAX.
UNIT ns ns ns ns ns ns ns ns ns ns ns ns
t AVAX t E1LWH t AVWL t AVWH t WLWH t WHAX t BW t WLQZ t DVWH t WHDX t GHQZ t WHOX
tWC tCW t AS t AW tWP t WR1 tBW tWHZ tDW tDH tOHZ tOW
70 70 0 70 50 (CE2,CE1,WE) 0 60 0 30 0 0 5
-------------
-------30 --30 --
100 100 0 100 70 0 80 0 40 0 0 10
-------------
-------40 --40 --
Date Byte Control to End of Write (LB,UB) Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active
SWITCHING WAVEFORMS (WRITE CYCLE)
WRITE CYCLE1 (1)
t
ADDRESS
WC
t WR
OE
(3)
CE2
(5)
t CW
CE1
(5)
(11)
t
LB,UB
(5)
BW
t AW
WE
(3)
t AS
(4,10)
t WP
(2)
t OHZ
D OUT
t DH t DW
D IN R0201-BS616UV8011 Revision 2.2 April 2001
6
BSI
WRITE CYCLE2 (1,6)
BS616UV8011
t WC
ADDRESS
CE2
(11)
CE1
(5)
t t
CW
BW
LB,UB
(5)
t
WE
AW
t WP
t WR
(3)
(2)
t AS
(4,10)
t
DH
t WHZ
D OUT
(7)
(8)
t DW t
DH (8,9)
D IN
NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE2 going low, or CE1 or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE2 high transition or CE1 low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE2 is high or CE1 is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE2 going high or CE1 going low to the end of write.
R0201-BS616UV8011
7
Revision 2.2 April 2001
BSI
ORDERING INFORMATION
BS616UV8011
BS616UV8011
XX
-- Y Y
SPEED 70: 70ns 10: 100ns
GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE B: BGA - 48 PIN(8x10mm) F: BGA - 48 PIN(9x12mm) D: DICE
PACKAGE DIMENSIONS
0.05
0.25
NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
SIDE VIEW
D 0.1 D1
N 48 D 10.0 E 8.0 D1 5.25 E1 3.75 e 0.75
SOLDER BALL
0.35
0.05
e
E1 VIEW A
48 mini-BGA (8 x 10mm)
R0201-BS616UV8011
E
0.1
8
Revision 2.2 April 2001
BSI
PACKAGE DIMENSIONS (continued)
0.25 0.05 1.4 Max.
BS616UV8011
NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
SIDE VIEW
D 0.1 3.375 D1
N 48
D 12.0
E 9.0
D1 5.25
E1 3.75
e 0.75
SOLDER BALL 0.35 0.05
e
VIEW A
48 mini-BGA (9 x 12mm)
2.625
E 0.1
E1
R0201-BS616UV8011
9
Revision 2.2 April 2001
BSI
REVISION HISTORY
Revision
2.2
BS616UV8011
Description
2001 Data Sheet release
Date
Apr. 15, 2001
Note
R0201-BS616UV8011
10
Revision 2.2 April 2001

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